GIGABYTE ultra durable 3 classic
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POSTER: computer news || GIGABYTE ULTRA DURABLE 3 CLASSIC |
DATE:2009-01-21 |
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GIGABYTE technologies (Gigabyte) company in this month presented the technology ultra durable 3 classic for AMD platform . This technology is used in the majority of motherboards on base of AMD company chipset :790GX, 790X, 780G and 770 (platform socket AM2+). It provides copper layers with 70 m thickness for power layer and motherboard grounding layer . This ensures a considerable reduction in the operating temperature, increase in the energy effectiveness and stability under overclocked conditions. For comparison : the thickness of each layer in standard printed-circuit board is 35 m.  The doubled copper layer thickness provides a more effective cooling due to the rapid heat withdrawal from the critical motherboard sections , including the processor and power components . Furthermore, the doubled copper layer thickness reduces the impedance of conductors by 50%. This means that the summary energy losses are reduced by 50%. Furthermore, the solution proposed ensures the necessary signals quality , guaranteeing a stable system work and ensuring additional potential for overclock. Motherboard series ultra durable 3 classic support DDR2 memory, which works at the frequency 1200 MHz and above, and 45-nm AMD processors , designed for installation in AM3/AM2+. These motherboards use only Japanese capacitors with the solid electrolyte . From other special features let us note the technology energy-economy easy energy saver and the function DualBIOS. Related Products : | ||
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GIGABYTE ULTRA DURABLE 3 CLASSIC |
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