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 - LG will release a mini version of the Android-smartphone G6 - FSP Introduces Windale 4 and Windale 6 Processor Cooling Systems - Nintendo sold more than 2.7 million consoles Switch - Intels solid-state memory will continue to be used in Western Digital Corporation -


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POSTER: computer news   ||    LG WILL RELEASE A MINI VERSION OF THE ANDROID-SMARTPHONE G6

DATE:2017-04-30

Introduced in February 2017, the flagship smartphone LG G6 will receive a mini version.

LG is going to soon release a mini version of its flagship.  LG G6 mini will look like the original LG G6, but it will get 5.4-inch display instead of 5.7-inch.  The screen will retain an unusual aspect ratio of 18: 9 or 2: 1.  Whether the compact model from the full-size flagship will carry the entire "stuffing", including the Qualcomm Snapdragon 821 chip, 4 GB of RAM and the heat pipe, is not specified.

Most likely, LG G6 mini will be focused primarily on emerging markets.

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LG will release a mini version of the Android-smartphone G6

 LG will release a mini version of the Android-smartphone G6

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LG WILL RELEASE A MINI VERSION OF THE ANDROID-SMARTPHONE G6

POSTER: computer news   ||    FSP INTRODUCES WINDALE 4 AND WINDALE 6 PROCESSOR COOLING SYSTEMS

DATE:2017-04-30

FSP has introduced two new air cooling systems for processors, which are called Windale 4 and Windale 6 .  The manufacturer claims that the new products combine high performance with low noise, and are suitable for cooling new Intel and AMD processors, including new Ryzen processors.

The names of the cooling systems Windale 4 and Windale 6 reflect their key difference - the number of heat pipes.  The first novelty has four tubes and its dimensions are 122 x 83 x 158 mm, while the second one is built on six tubes, and its dimensions are 122 x 110 x 165 mm.  The heat pipes are made of copper, have a diameter of 6 mm, and directly contact the processor cover.

For blowing radiators in both new products meet 120-mm fans, built on sliding bearings.  They are able to rotate at a speed of 600 to 1600 rpm, creating an airflow of up to 60 CFM (101.94 m3 / h), and their noise level does not exceed 32 dBA.  Note that in the Windale 6 cooling system the fan is equipped with a blue LED light.

The cooling systems Windale 4 and Windale 6, according to the manufacturer, can draw up to 180 and 240 watts of heat, respectively.  The novelties, as it was said at the very beginning, are compatible with all the latest Intel and AMD processor connectors, including LGA 1151 and LGA 2011-3, and also Socket AM4.  

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FSP Introduces Windale 4 and Windale 6 Processor Cooling Systems

 FSP Introduces Windale 4 and Windale 6 Processor Cooling Systems

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FSP INTRODUCES WINDALE 4 AND WINDALE 6 PROCESSOR COOLING SYSTEMS

POSTER: computer news   ||    NINTENDO SOLD MORE THAN 2.7 MILLION CONSOLES SWITCH

DATE:2017-04-30

Nintendo company  has published a report for the 2016 financial year , which for it ended on March 31, 2017 calendar year.  From the document it follows that the launch of sales of the new hybrid console Nintendo Switch can be considered successful, and the console is popular among users.

The console was released on March 3, and in less than a month the Japanese company around the world managed to sell about 2.74 million copies of the novelty.  The number of games sold and other software for this console was 5.46 million copies.  The main game for the novelty - The Legend of Zelda: Breath of the Wild - sold out in an incomplete month with a circulation of 2.76 copies.

At the moment, the demand for a hybrid console Nintendo Switch remains very high, and sometimes even exceeds the offer.  However, the company plans to soon finalize the delivery.  In the new fiscal year that began this month, that is, until March 2018, it is planned to supply more than 10 million copies of the console, and according to other sources, it will be 16 million.

 

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Nintendo sold more than 2.7 million consoles Switch

 Nintendo sold more than 2.7 million consoles Switch

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NINTENDO SOLD MORE THAN 2.7 MILLION CONSOLES SWITCH

POSTER: computer news   ||   INTELS SOLID-STATE MEMORY WILL CONTINUE TO BE USED IN WESTERN DIGITAL CORPORATION

DATE:2017-04-28

At the quarterly reporting conference Western Digital Corporation, there were many things that representatives of the company refused to talk about.  First, the topic of negotiations with Toshiba concerning the purchase of the latter assets, connected with the production of solid-state memory, was banned.  These assets, if they do not leave WDC, then the new owners of the core business of the last of the companies will have to build relationships that will allow the joint venture in Japan to maintain the NAND chips.

Secondly, the management of WDC refused to make forecasts on the rate of transition to the use of magnetic plates with a tile record.  

But about the possibility of using SanDisk's memory in solid-state drives for the corporate segment, it was said openly: the corresponding work is being done, its results are quite satisfactory for the WDC management.  Nevertheless, it favors the company and cooperation with Intel, which began when HGST was an independent company.  WDC is going to use Intel / Micron memory  production in its solid state drives for several products generations  , at least.  Both sources of NAND chips will be used in parallel.

 

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Intels solid-state memory will continue to be used in Western Digital Corporation

Intels solid-state memory will continue to be used in Western Digital Corporation

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INTELS SOLID-STATE MEMORY WILL CONTINUE TO BE USED IN WESTERN DIGITAL CORPORATION

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