TSMC will jump immediately from 28nm to 20nm

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POSTER: computer news   ||   TSMC WILL JUMP IMMEDIATELY FROM 28NM TO 20NM	DATE:2010-04-14
Recently, we could observe immediately two important contract semiconductors producers,    TSMC and Globalfoundries company, decided to forego the application of 32 nm technical process with the production of microcircuits with high energy consumption in favor of more advanced 28 nm technical process. Yesterday TSMC company also stated about its intention to pas” 22 nm technical process, and to the end of 2012 to master the microcircuits production on 20 nm technology. First TSMC will master the release according to these technological standards of microcircuits with the high operation speed,  and on a half of a year later it will release microcircuits with the lowered energy consumption. Producers desire to pass some intermediate steps of lithographic technical process completely regularly. Numerous problems of technological and economic nature appear in proportion to the decrease of transistor sizes in the semiconductor microcircuits, and expenditures for the mastery of close ones in the parameters of technological processors are approximately compared. Under these conditions, the producers prefer to master thinner  technical process, which will bring more profit. Within the 20 nm technical process TSMC is assembled to as before use a flat switching-circuit structure of microcircuits with ten-time  conductors layers,   without resorting to  more complex three-dimensional structures. The materials with the high value of dielectric constant and transistors with the metallic lock will be used with the production of microcircuits on 20 nm technology, and it is decided to refuse from the traditional dioxide of silicon. The use of copper interconnections with the ultralow resistance will be the new update:   low- R copper. TSMC expects to use lithographic equipment with the wavelength of laser 193 nm and method of immersion lithograph, but without the optimization.  Further TSMC plans to reconstruct with the lasers ultrahard ultraviolet radiation (EUV) and the maskless technology. The release of productive microcircuits (chipset and video chip, for example) on 20 nm technology TSMC can begin in the first quarter of 2013. The first 28 nm microcircuit will appear already at the end of September present year. Related Products :

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