TSMC will acquire equipment for EUV- lithograph in the next year

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POSTER: computer news   ||   TSMC WILL ACQUIRE EQUIPMENT FOR EUV- LITHOGRAPH IN THE NEXT YEAR	DATE:2010-06-28
Conversations about the forthcoming passage to the use of lithographic equipment with the ultrahard ultraviolet radiation (EUV) are conducted, but for the producers of microcircuits, until now, it was possible to put off the beginning of migration due to different contrivances. Globalfoundries, for example, will use lasers with the ultrahard ultraviolet radiation only within the technical processes with the standards less than 20 nm. Intel is assembled in 2013 to master immersion lithograph and 15 nm technical process, and the EUV- technology will be adapted at the factories of processor giant only within the 11 nm.   According to the chapter of  R & D TSMC company division, this contract producer will obtain the first lithographic equipment with the support to the technology of ultrahard ultraviolet radiation in 2011. This technology will be inculcated not earlier than 2013, when production of microcircuits  on 20 nm standards is mastered. The equipment for  ASML production will allow to process up to 100 silicic plates per hour,  TSMC company will issue the first 20 nm production in the second-half of 2012 at the factory fab 12,  capable of processing silicic plates with 300 mm diameter. Related Products :

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