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Based on the example Of Intel the important producers of semiconductor chips consider it expedient to be packed in the expansion of production capacities. TSMC Company will tomorrow place the foundation of still one factory for the production of chips on 300 mm silicic plates. Fab 15 will originally produce microcircuits on 40 nm technology, and subsequently it will participate in the mastery of 28 nm and more thin technical processes.
Fab 12 and Fab 14, releasing microcircuits from the silicic plates of 300 mm diameter, will also undergo expansion. In the third quarter this year will phase 5 will start in Fab 12, and to the end of year will be completed the building phase 4 of Fab 14. The annual output at TSMC factories will reach 11,24 ml silicic plates in the equivalent of standard size 200 mm. foremost technological processes will occupy up to 50% output at the factories with the plates of standard size 300 mm. Originally TSMC planned in this year to spend as capital investments approximately $4,8 billion, but recently the head of company acknowledged that the sum of expenditures will be increased.
TSMC needs the expansion of production capacities. For example, AMD partners suffer from a deficiency on 40 nm video chip. NVIDIA also actively increases the fraction of 40 nm video chip in the assortment of its production. Related Products :
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