The technology of semiconductor microcircuits production is complicated, since the density of transistors arrangement on the crystal continuously grows, and for their creation will be required thinner tools.
Intel company , for example, plans to inject EUV- technology not earlier than 11 nm microcircuits . If we considers that in 2013 company intends to use with the production of 15 nm microcircuits the good old immersion lithograph, then it is necessary to design the introduction of EUV- technology not earlier than the second-half of decade.
TSMC company will purchase equipment for the work with the laser with the ultrahard ultraviolet radiation in 2011, in the mass production EUV- technology will be inculcated not earlier than 2013, when will appear 20 nm microcircuits. Intel and TSMC decided to acquire from ASML holding the test batch of equipment, which works with the ultrahard ultraviolet.
Globalfoundries is disposed to immediately acquire equipment for the series production of microcircuits with the use of EUV- lithograph - this will be made in the second-half of 2012. The injection of technology in the mass production will be not earlier than 2014-2015 .
It is remarkable, that Globalfoundries plans to forego the use of immersion lithograph already within the 22 nm or 20 nm technical processes, which imperils them delay up to 2014. In the opinion of company representatives, the release of 22 nm microcircuit according to the method of immersion lithograph is more expensive than the use of EUV- technology. TSMC and Intel will master the production of 22 nm chips much earlier, still within the immersion lithograph, and globalfoundries solution can negatively affect AMD business .