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The company SMART modular technologies added new memory modules : the buffered memory DDR2 (RDIMM), designed for liquid cooling. Producer assert that the liquid system has higher efficiency than air, built on the use of radiators and fans.
Created with the application of technology DDP (dual-die-package) modules correspond to specifications VLP (low-profile modules), and in their construction is used the quadrilateral flexible printed-circuit board which covers the aluminum core .
Memory module SMART with liquid cooling coolFlex DDR2 VLP RDIMM are accessible in versions with volume 2 and 4Gb (logical organization 256M x 72 and 512M x 72, with number - SG572564XG8E0IL1 and SG572124XG8P0IL1, respectively).
Mainly, new buffered DDR2 memory are intended for blade- servers and supers-computer, built with liquid cooling system. Related Products :
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