As we reported, during CES 2012, which took place this week, AMD company showed the APU Trinity . Simultaneously, the participants could see the hybrid processor Trinity in three different versions .
Various packaging version use different form factors. The Left one is the processor in FP2 BGA packaging . It will be used in ultra-compact laptops and similar devices.
In the center is located APU FS1r2 uPGA . In contrast to the processors FP2 BGA, which will be soldered to the motherboard, CPU performance in FS1r2 uPGA designed for installation in slot.
The third packaging type - FM2. The processors in this design is intended for desktops.