A three-dimensional chips design Developed

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POSTER: computer news   ||   A THREE-DIMENSIONAL CHIPS DESIGN DEVELOPED	DATE:2013-02-06
Scientists at Cambridge University have made a breakthrough in microelectronics.  They have created the world's first 3d chip, in which data is distributed in all three dimensions.   Earlier chips were flat design, and to reduce the chip area, there was a multilayer, or applied technology chip-on-chip.  The development in question allows the signal to move on the entire volume of chips without restrictions. This has been achieved through the use of spintronics - the signal inside the chip is not transmitted as electrons but in their spin state.  The internal structure of multi-chip.  Cobalt and platinum layers are responsible for data storage, and ruthenium transmits signals between layers.   Related Products :

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