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According to experts from the analytical agency IC Insights , in late 2012, 27.3% of global capacity for the manufacture of semiconductor wafers were employed in the manufacture of products to the topological rules of less than 40 nm. This is mainly memory chip DRAM and NAND, high performance processors and a variety of specialized integrated circuits and gate arrays.
At the same time, 21.8% of the capacity is focused on products with 90, 130 and 180 nm.
Note that the production of more than 400 nm takes a considerable share in the overall picture. This is due to a high demand for standard analog and logic integrated circuits for general use. In addition, processes of this class are used for the production of products, designed to operate at high voltage.
A leading supplier of chips to the topological rules of less than 40 nm was Samsung company . Related Products :
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