TSMC will start processing 450-mm wafers in 2017

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POSTER: computer news   ||   TSMC WILL START PROCESSING 450-MM WAFERS IN 2017	DATE:2013-05-13
To stay in the place of the world's largest contract chipmaker, TSMC companies not only have to invest heavily in research and development and modernization of the physical assets, but also stick to the development plan  , which was compiled for the nearest five years . TSMC once again confirmed their intention to switch to  450-mm silicon wafers in 2017. The first production line will be built during 2016-2017, the factory equipment will be installed for lithography in the deep ultraviolet (EUV).  At the end of 2017 on this industrial production line TSMC plans to start producing chips with topological 10 nm process technology will subsequently reduced to 7 nm. JK Wang, vice-president of TSMC, said that suppliers of  lithography equipment,  do not plan to invest in the development of solutions for processing 450-mm wafers before, now changed their position.  Thus, every major manufacturer is willing to invest up to 15% of its budget on research and development activities in the development of technologies related to the 450-mm plates. TSMC itself  only this year will spend $ 1.5 billion on R & D.  The company's expenses to the needs of the research division increased each year: in 2010, the budget for it has contributed more than $ 1 billion in 2012 reached a total value of $ 1.36 billion. TSMC vice president of worldwide sales and marketing, Jason Chen  also stated that the manufacturer is planning in 2013 to triple the capacity of 28-nm production in 2014 to begin mass production of 20-nm technology and accelerate the pace of  16 - and 10-nm technology development. Related Products :

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