AMD already stated that the first generation of hybrid processors fusion will in the best case unite two different crystals in one packing, and the integration of different cores on one crystal can be done only through several years. Today appeared a completely interesting information about fusion processors . With reference to sources familiar with AMD plans , the first generation of fusion processors will unite on one base layer two different core. The first of them will contain one or several processor cores, memory controller and hyperTransport controller. The second will be the graphic core, it will be connected with the first with using the special interface . Recently AMD representatives talked about this interface : an interface which resembles to CrossFire.
We should note that the 8 core processors shaghai from AMD production will also use a multi-chip packing, uniting in one packing two four core crystals.
Associates report that for fusion production will be used the labor division of AMD and Chartered semiconductor , they will release processor cores, and the production of graphic part will be in TSMC.
Associate also reports that for fusion processors are prepared the new sockets : Socket FM1, Socket FM2, Socket FM3. In any case, in the segment of mobile devices , fusion processors can exist in a similar variety of design concepts. Which is characteristic, the built-in graphic core processor will be support the displayPort interfaces , HDMI, DVI and TV-out. This is very convenient for the multimedia devices with the high integration degree.