|
When, in 2010, Intel announced plans to build a new semiconductor factory in Oregon - D1X factory in Hillsboro, it turned out that something is wrong. And the foundation was stronger, and the volume of the factory premises clearly went beyond the requirements provided for installation of processing 300-mm wafers, as well as power factory have been overstated. Later, Intel admitted that the first module factory D1X will actually be able to place a line for processing 450-mm wafer, but for the moment the factory will process all the same 300-mm wafers. But the second module D1X will immediately start its production activities from processing 450-mm semiconductor wafers.
Intel has started to build last week the second module factory D1X. From the earliest statements CFO Intel knows that in the construction will go about $ 2 billion , D1X The second module will be identical in size to the first module, which again confirms the long-standing plans for Intel. Later, the first module can be replaced by a line 300 mm 450 mm.
Since the typical cycle of building and communication is two years, it will be completed by mid-2015. By this time ASML company just prepare experienced scanners for immersion lithography on 450mm wafers. It is easy to imagine that Intel will be the first customer to receive the equipment and, accordingly, the first manufacturer to master the commercial release of decisions on larger diameter wafers. It will happen, apparently, in the period from 2016 to 2017. Related Products :
|