Intel confirms the difficulties with the development of equipment for 450-mm wafers

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POSTER: computer news   ||   INTEL CONFIRMS THE DIFFICULTIES WITH THE DEVELOPMENT OF EQUIPMENT FOR 450-MM WAFERS	DATE:2014-03-20
According to previous plans mass production using plates 450-mm wafers increased diameter expected in 2017-2018.  Now we are talking about the date 2023. Intel reduced the funding of  ASML company , which is now unable to load a significant part of the existing production at its disposal.  I Intel representative , Chuck Mullo, acknowledged that his company was forced to adjust funding 450mm project of ASML in accordance with the changed plans this developer production equipment.  Translated into plain language, this means that funding is reduced.  However, Intel still expects to see mass production of semiconductors on 450-mm wafers before the end of the decade. Related Products :

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