According to DigiTimes, the company United Microelectronics Corporation (UMC) continues to develop advanced manufacturing technologies of semiconductor structures and in the first half of 2015 is going to start production process using 14 nm FinFET. UMC is working with IBM to develop a 14-nm technology.
Currently, the production capacity UMC loaded on 90%, almost fully occupied factories, processing of the substrate size of 200 mm. According to the newspaper Economic Daily News (EDN), UMC plans to increase the volume of processed 200-mm wafer to 48-50 thousand units per month from the current 44 thousand due to Hejian Technology subsidiary in Shanghai.
Now UMC has more than 20 customers for products with topological 28 nm, for ten customers mass production will begin this year. Orders for 28-nm products will bring 5% of total revenue for the year.