MSI company has offered to their motherboards a kind of safety cage that allows a cooling system for processors.
Fortunately, in order to avoid the unfortunate consequences of scalping processor in the LGA 2011, MSI offers users an illustrated guide for those wishing to remove the heat spreader.
When cutting the sealant around the perimeter of the lid should be noted that at a distance of five to eight millimeters from the edge of the printed circuit board are capacitors, which can be damaged by knife. Cover must be separate from the processor in a heated state, so that the solder did not have time to harden. Solder residue from the processor die, too, can be removed with a hair dryer. Such operations deprive the owner of the processor from warranty. Related Products :
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