From ordinary Haswell processors new models LGA 2011-3 distinguished not only by the configuration of the crystal, but also the presence of a heat-spreading solder more successful thermodynamic properties as compared with thermal paste. Meanwhile, immediately after the announcement of a new line of extreme Intel processors in the network appeared rumors that the low-end model in the face of Core i7-5820K use thermal paste.
Note that the array packages crystals CPU is a separate process, changes to which can hardly justify that cost savings that can be obtained by substituting the thermal interface in the production of a single processor model. Proponents of this theory and Japanese journalists site PC Watch, decided to confirm it experimentally. Related Products :
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