UMC company has received orders for LTE-making on the 28-nm technology from Qualcomm company . Delivery of finished products should begin as early as this quarter, as indicated by industry sources.
UMC plans to increase volumes of plate manufacture with topological 28 nm to 20 thousand units per month by the end of this year to meet demand from Qualcomm and MediaTek. In addition, the company increased production of 200-millimeter wafers to 60,000 units per month in the factories of its subsidiary Hejiang Technology in China in connection with the increase in the number of orders for production with the standards of 0.11-0.18 microns.
Separately, it is reported that UMC will build a new factory in Xiamen. The construction will be spent over $ 6.2 billion, the factory will begin its work in 2016 and will produce up to 50,000 300mm wafers per month with the norms of 40-55 nm initially. UMC believes that the new factory will allow it to increase its market share in the contract chips manufacturing .