News agency IDG News Service referring to Intel company representative , Mark Miller , reported that Intel reject the lot of components for optical modules new generation. Silicon is transparent to signal transmission in the infrared range, so the optical channels can be integrated into the processor. But in the future. In the meantime, we are talking about the external piping.
Unfortunately, the source did not disclose the details of which components silicon photonics did not satisfy Intel requirements .
Now about the interface. As conceived by Intel, the first phase of expansion is the use of optical interfaces must be implemented as soon as possible and inexpensive connector port. Together with Corning, US Conec, TE Connectivity and Molex designed plastic connector, which consists of the minimum required number of parts, and does not contain expensive metal or ceramic parts. To avoid a simplified connector the signal loss in the optical interface location of the contact lines, the focus optical system somewhat blurred - spot diameter is slightly larger than in the case of conventional optical interfaces. In this case, each cable can contain up to 64 transmission fibers, which gives a maximum speed of 1.6 Tbit / s at distances up to 300 meters. According to Intel, the new interface is fundamentally solve the problem of the organization of high-speed channel between the shelves and racks in data centers. Related Products :
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