As is known, HBM memory for improved specification, which informally called HBM 2, Samsung started producing with 4GB chips with a capacity of 256 GB / s. According to rumors, the company SK Hynix will release a similar product in the third quarter this year. This did not prevent SK Hynix to lead the conference GTC 2016 memory chip samples HBM 2.
The manufacturer said that the next phase will begin mass production 8 GB of memory chips HBM 2 and more affordable two-layer 2 GB chips. This is a very complex production, but an unnamed customer insists on the priority production of more capacious chips. Samsung has also begin to release 8-GB memory HBM 2 at the second stage . The main consumer of 8 GB memory HBM will be NVIDIA with its monsters GP100 .
Interestingly, consumption of 8-layer chip HBM 2 is not much more than the consumption of 4-layer chips. The company declined to give an exact figure, but hinted that the difference is within 10%. In other words, the on-board memory capacity will significantly improve the thermal budget package.
Speaking of packing. To cool the memory chips HBM one heatsink to the processor, specifically their height had increased. Related Products :
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