SK Hynix is ​​almost ready for the 48-layer 3D NAND mass production

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POSTER: computer news   ||   SK HYNIX IS ​​ALMOST READY FOR THE 48-LAYER 3D NAND MASS PRODUCTION	DATE:2016-11-09
As we have repeatedly noted, truly mass production of multi-layered or vertical flash type 3D NAND mastered only two companies - Samsung, which occurred more than two years ago, and Micron company in a couple with Intel, which took place less than a year ago.   According to source, SK Hynix plans to begin in late November  the 48-layer 3D NAND chips mass production.  From the third quarter  last year, the company was able to produce only a month of 10 000 plates with a 36-layer memory 3D NAND (128-Gbit MLC).  By the end of the current year the volume of production will be expanded to 20-30 000 wafers per month and it will have 48-layer chip 3D NAND (256-Gbit TLC).  Thus, the South Korean manufacturer will bring 3D NAND memory share in its flash products to the 15%. According to analysts IHS Markit company , the share of 3D NAND increases steadily.  So, in 2015 on the multi-layered memory accounted for only 6.7% of the total flow of the flash memory NAND-type.  In 2016 the share of 3D NAND has risen to 23.6%, and promises to increase to 57.8% in 2017.  It just means that the products are based on multilayer chip - all types of solid-state drives - will be cheaper. Next in line in the plans of SK Hynix introduction of 72-layer 3D NAND, whose development is in full swing.  It will happen closer to the end of next year.  Today's most advanced memory 3D NAND, being in mass production, it is considered 64-layer memory.   Related Products :

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