TSMC will introduce EUV-lithography in the late version of 7-nm process technology

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POSTER: computer news   ||   TSMC WILL INTRODUCE EUV-LITHOGRAPHY IN THE LATE VERSION OF 7-NM PROCESS TECHNOLOGY	DATE:2017-04-25
Leading manufacturers of semiconductor products have different views on the timing of the introduction of lithography using ultra-high-ultraviolet radiation (EUV).  Some ready to implement these methods already within the limits of 7-nm standards, other prefers to wait until the time of mastering 5-nm technology.  As explained by DigiTimes , one of the two TSMC CEOs, Mark Liu, recently confirmed the company's intention to introduce EUV lithography in the second generation 7-nm process technology.  By internal designation, this process technology has a conventional name "7nm Plus". The first generation of 7-nm products using FinFET-structures will begin to descend from the TSMC pipeline in 2018.  In the second half of this year, TSMC will master mass production of products using 10-nm technology.  The team of 3000 specialists worked on its development and implementation.  Already, the development of 5-nm technology is underway, prototypes of products should be received in the first quarter of 2019.  TSMC is also being thrashed on a 3-nm process technology - hundreds of specialists are already working on its development. Mobile devices will continue to be the main consumer of advanced semiconductor products in the coming years, according to the head of TSMC.  Smartphones will acquire functions for working with virtual and augmented reality, artificial intelligence and learning systems, as well as "contextual calculations."  The automotive industry and the "Internet of things" are also becoming important market segments, demonstrating the demand for semiconductor products.   Related Products :

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