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Following Toshiba , micron technology company announced the E-MMC memory. This built-in memory type will be widely used in mobile devices .
As in case of toshiba production , micron production will have the highest memory density , which satisfies the standards and the accessible today (32 Gbit) .The maximum memory capacity will be 32 GB. The 32 GB e-MMC MTFC32GHKDN-WT Micron Memory will be produced on the 34 nm technical process (MLC NAND) and possess the extended temperature conditions (from -40C to +85 C ., which is switable for different applications (cell phones, PDA, automobile electronics and camera).

Remaining characteristics e-MMC MTFC32GHKDN-WT:
- Productive memory controller multiMediaCard (MMC)
- Packing type : 153- FBGA
- Correspondence to roHS standards
- Support to errors correction (ECC)
- Supply voltage: 3,3v
- Sizes: 14 x 18 x 1,4 mm
The serials e-MMC memory models will appear to the end of August,. Related Products :
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