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 - Western Digital Corporation is ready to pay for Toshiba more - Intel promises to endow the future processors with Thunderbolt 3 support - China promises to become the locomotive of production development on FD-SOI substrates - New trailer Dirt 4 dedicated spectacular rally cross -


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POSTER: computer news   ||    WESTERN DIGITAL CORPORATION IS READY TO PAY FOR TOSHIBA MORE

DATE:2017-05-25

American corporation Western Digital was in a difficult situation : it recently spent a lot of money on the purchase of SanDisk assets, and around the sale of Toshiba's core assets, a scandal is born.  WDC believes that it has a priority right to bid, since SanDisk had a joint venture with Toshiba, which is just releasing NAND-type memory.  However, free funds from WDC are no more than $ 7 billion, and some competitors in the auctions for Toshiba assets are ready to offer twenty billion more.  From despair, WDC is trying to block the sale of Toshiba assets through the court, difficulties arise in the operation of the joint venture in Japan.

As the edition of The Japan Times notes, the US manufacturer of hard drives and solid-state drives is ready to raise rates in the fight for Toshiba's core assets up to $ 17.8 billion, but the scheme for financing the deal does not suit the seller.  WDC is ready to provide three-quarters  the amount with convertible preferred shares, which can be turned into ordinary shares only after a few years.  Another quarter of this amount should be provided by partners in the transaction in the face of Japanese investors (INCJ and DBJ) with state participation.

Even the participation of Japanese investment structures, as the source notes, will not allow to avoid the expectation of approval from the antimonopoly authorities, which risks delay.  For Toshiba, it is important not only the amount earned from the sale of assets, but also the timing of money receipt  .  If it does not cover the losses from the activities of the North American subsidiary of the energy company by March next year, it may be excluded from the quotation list of the Tokyo Stock Exchange.  WDC is acting aggressively, threatening to block out competitive deals by legal means, and at the same time not offering "live money" in sufficient quantities that Toshiba badly needs.

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Western Digital Corporation is ready to pay for Toshiba more

 Western Digital Corporation is ready to pay for Toshiba more

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WESTERN DIGITAL CORPORATION IS READY TO PAY FOR TOSHIBA MORE

POSTER: computer news   ||   INTEL PROMISES TO ENDOW THE FUTURE PROCESSORS WITH THUNDERBOLT 3 SUPPORT

DATE:2017-05-25

This week, Intel decided to recall its historic role in promoting the USB interface to the market.  It should be recognized that it was the support for new versions of USB with Intel's chipset that promoted the popularity of the corresponding interface generations  .  As soon as the infrastructure ripened, more compatible devices became available on the market, prices fell, and the appropriate cables and connectors became available.

Recently, Intel made it clear that it wants to apply this experience and to increase the popularity of  Thunderbolt 3 interface. In theory, when Intel and Apple started to promote this standard, everything looked beautiful only on paper: the interface promised high data transfer rates and the use of unified connectors, to One port could connect a bunch of different devices, it was even possible to recharge laptops.

In practice, the peripherals supporting Thunderbolt 3 are still rare and expensive, to implement the interface support, not the cheapest controllers are required.  Intel now promises that not only it implements Thunderbolt 3 support with the forces of future processors, but also in the next year will open access to interface documentation to all willing developers - completely free.  Thus, even AMD can theoretically realize support for the Thunderbolt 3 interface in its future products. Apple does not object to these Intel initiatives , and only welcomes the expansion of the ecosystem.  It is expected that the connectors, ports and cables USB-C will become the main universal infrastructure.

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Intel promises to endow the future processors with Thunderbolt 3 support

Intel promises to endow the future processors with Thunderbolt 3 support

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INTEL PROMISES TO ENDOW THE FUTURE PROCESSORS WITH THUNDERBOLT 3 SUPPORT

POSTER: computer news   ||    CHINA PROMISES TO BECOME THE LOCOMOTIVE OF PRODUCTION DEVELOPMENT ON FD-SOI SUBSTRATES

DATE:2017-05-25

Yesterday, the authorities of the Chinese city  Chengdu, within the framework of cooperation with GlobalFoundries, announced an investment in the joint project of $ 100 million. This is part of the joint investment of more than $ 10 billion, which will be spent on the construction of a new semiconductor plant near Chengdu.  But this will not be an ordinary plant.  This enterprise along with the processing of ordinary "solid" 300-mm substrates will be able to produce chips on FD-SOI substrates.  Substrates FD-SOI, we recall, contain a very thin insulating layer of completely depleted silicon inside the silicon wafer.

Due to the additional insulation, the leakage currents in the FD-SOI chips are reduced to values that on conventional plates can be achieved only with the use of 10 nm process technology and the FinFET of transistors.  This allows the release of 28/22 nm chips on FD-SOI plates, whose speed and power characteristics (consumption) are inferior to chips with 14/16 nm holes and FinFET transistors.  Simply put, without a significant increase in production costs, chips on FD-SOI plates open up the same opportunities as more expensive 14-nm FinFET solutions on monolithic plates.

Problems with the wide use of FD-SOI are exactly two - this is the need for large initial investments and the interest of developers.  The latter includes the training of personnel: the publication of educational literature, the organization and implementation of training courses in training processes, the establishment of consulting centers and technical support.  In fact, it is necessary to create a design culture for producing solutions on FD-SOI plates.  Let's add, for chips on FD-SOI the convenient technology of giving of a food with displacement (body bias) is created.  The displacement can be direct and reverse with an amplitude of +/- 3 V. This technology allows to reduce the voltage of the gates of transistors and to save significantly on the power supply of the chips.

As it turned out, only China can create a culture of design and production using FD-SOI plates.  China became the main consumer of semiconductors in the world.  Only in China is enough free money and an understanding of the prospects to invest in the creation of a broad infrastructure for raising production on FD-SOI plates.  The investments, which we mentioned at the beginning, were just the concrete investment of the Chengdu authorities in the creation of the FD-SOI infrastructure in the area of construction of the new GlobalFoundries plant in China.  This is the construction of facilities that will allow to attract consulting companies and designers to a specific production.  A kind of campus for promoting and popularizing technologies related to the release of solutions on plates with an insulator.

 GlobalFoundries plant in Chengdu will be commissioned in early 2018.  In 2018, the company will start producing chips on monolithic plates.  The release of 22-nm chips on FD-SOI plates will start in 2019 (the 22FDX process technology).  A similar upgrade GlobalFoundries holds at the plant in Dresden.  The treatment of FD-SOI plates in Germany can begin a year earlier.  It is expected that the use of FD-SOI will provide a breakthrough in the production of chips with radio-frequency components (modems and the like), and will also become a Klondike for the release of things with an Internet connection.  

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China promises to become the locomotive of production development on FD-SOI substrates

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CHINA PROMISES TO BECOME THE LOCOMOTIVE OF PRODUCTION DEVELOPMENT ON FD-SOI SUBSTRATES

POSTER: computer news   ||    NEW TRAILER DIRT 4 DEDICATED SPECTACULAR RALLY CROSS

DATE:2017-05-25

The developers of the automotive arcade Dirt 4 have prepared a new trailer dedicated to the rally-cross.  It is important to immediately make a reference to the fact that the project is the official game of the FIA World Rallycross World Championship.  Direct participation in the process of modeling the local virtual trails was hosted by Peter Solberg (Petter Solberg).  This is a two-time winner of the international championship FIA World Rallycross.

In Dirt 4 fans of rally-crosses are waiting for the following disciplines: Super 1600, RX2, Group B classics and Supercar.  Among the available routes will be exactly Lydden Hill, Lohéac Bretagne and Montalegre.

 

The developers assure that in Dirt 4 it will be possible to test more than 50 rally cars, among which there are Subaru WRX STI NR4, Audi Sport quattro S1 E2, Ford Festa R5 and Mitsubishi Lancer Evolution VI.

Dirt 4 should go on sale on June 9 on PC, Xbox One and PlayStation 4.

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New trailer Dirt 4 dedicated spectacular rally cross

 New trailer Dirt 4 dedicated spectacular rally cross

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NEW TRAILER DIRT 4 DEDICATED SPECTACULAR RALLY CROSS

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