GlobalFoundries Company, already learned how to produces 28nm APU Kaveri (in former factories AMD in Dresden), and UMC company has adapted its 28-nm process technology specifications for the release of ARM SoC cores on ARM Cortex-A7.
According to an official press release from the Taiwanese company UMC, assembly using cores ARM Cortex-A7 will be manufactured using 28nm HLP-process technology. 28HLP designed for solutions combining qualities such as performance, low power consumption and small core size.
28HLP relies on an insulating substrate material as poly SiON. For a truly productive 28-nm SoC developers use an insulator with a high dielectric constant, which is compatible with transistors on a metal gate - the so-called HKMG-process.