ChipMOS Technologies will soon begin to pack the new 15-nm NAND-memory Toshiba

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POSTER: computer news   ||   CHIPMOS TECHNOLOGIES WILL SOON BEGIN TO PACK THE NEW 15-NM NAND-MEMORY TOSHIBA	DATE:2014-07-19
Known contract manufacturer,  ChipMOS Technologies company , published some information on its activities. ChipMOS Technologies has for more than a decade  been testing the packaging of integrated circuits, and in the number of its customers were noted such famous manufacturers like Samsung, Elpida, Sharp and others.  And now , according to the company, it has received orders from Toshiba package on package chips MLC NAND, made in compliance with the 15-nm process.  Production itself must be developed during August-September this year. Obviously,  the mass memory of the serial production company has already started.     ADATA Premier Pro SP920,   one controller chip, one chip buffer memory, and eight of flash memory chips.  Speaking of flash memory chips, then each such chip can be packaged ( one, and a few crystals ) (in modern SSD - up to 16). Often manufacturers NAND-memory engaged in production of finished products, charging the final testing and packaging of the manufacturer.  For example,  Micron, collaborating with Spectek, and  ChipMOS provides a similar service for Toshiba. Related Products :

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Xtreview Support N-Post:xxxx Xtreview Support	CHIPMOS TECHNOLOGIES WILL SOON BEGIN TO PACK THE NEW 15-NM NAND-MEMORY TOSHIBA
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