Samsung combines operational and solid-state memory for smartphones in the same package

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POSTER: computer news   ||   SAMSUNG COMBINES OPERATIONAL AND SOLID-STATE MEMORY FOR SMARTPHONES IN THE SAME PACKAGE	DATE:2015-02-04
The high degree of microelectronic components integration in modern smartphones are two  sided coin  .  On  one hand, it allows to reduce the size of printed circuit boards without compromising the functionality and reduce the cost of the finished product.  On the other hand, the fixed dialing degrades configuration options.  A recent quarterly report Qualcomm has shown that not all clients are ready for such unification for deeper integration, but because the developer will have to learn to create processors with its own architecture. But today we will talk about Samsung company , which announced the beginning of mass deliveries of memory chips with the layout ePoP, which allows to combine in one case 3 GB of RAM type LPDDR3-1866 and 32 GB solid-state memory such as eMMC, as well as the associated controller.  If we consider that all of this combination can be installed on the processor of the mobile device, occupied PCB space is limited to the square dimensions of 15 x 15 mm, which is 40% less than traditional layout.   The height of the package does not exceed 1.4 mm.  Reducing the footprint of the processor and memory chips, will free up more space for the battery .  Similar packings memory Samsung already offers for manufacturers of portable devices, and can now be applied not only to smart phones, but also in tablet, and other small portable devices. Related Products :

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