Heat pipes and evaporation chamber in various combinations have long been used by manufacturers of cooling systems . According to the website Tom's Hardware, the company Cooler Master is ready to combine case with the evaporation chamber heat pipes that they have received the total interior space.
At CES 2015 the company showed prototypes only reason for CPU cooling tower arrangement, which combined with the evaporation chamber heat pipes at such a deep level of mutual integration. According to the manufacturer, on the hardness of heat pipes such integration has virtually no effect. The technology is called 3D Vapor Chamber.
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