|
The release of intel nehalem processors will involve an increase in demand for multilayer base , designed for processor installation using the method inverted chip (flip-chip, FC).
Such base layers are necessary for nehalem, which will be characterised by high integration degree , realized due to the packaging of several chips in one package (multi-chip-package, MCP). For example, Bloomfield and Gainstown, besides the processor cores will get the integrated memory controllers , Havendale and Auburndale will get in addition a graphic cores, which will require a larger quantity of base layers. Other factors, which increase demand for FC- base layers, are the special feature of 45- nm process and the replacement of traditional south bridge to Habas PCH (platform controller hub), in the form of single-chip system.
The deliveries of FC- base layers for Intel already began to important producers : ibiden and Nanya printed circuit board (NPC). Moreover, NPC expects that the deliveries of base layers for 45- nm microcircuits, was in the fourth quarter 2007 5% and it will grow to 20% . Related Products :
|