Today multilayer chips are produced usually by layers separately and then assembled together. High temperature annealing of each layer does not allow to build up layers directly to each other. Elements of the lower layer will be destroyed in the manufacturing process of the upper layer. The exception is perhaps memory type 3D NAND - it is almost a monolith with its architecture and with three or four dozen layers. But much more interesting to create a multi-layered-type chip SoC with complete functionality. Stanford scientists have reported such a possibility. Anyway, they were able to create a prototype four-layer chips consisting of two layers in the form of arrays of DRAM-memory, separated by layers of transistors from carbon nanotubes.
Using nantrubok because the transistors with their use requires relatively low temperatures to produce the elements. It does not destroy the underlying layers . Related Products :
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