According to the website The Register, Microsoft Corporation at the industry event Hot Chips 28, told more details about this "customized solutions" used exclusively in HoloLens.
This processor was created on 28 nm technology by TSMC. It contains 24 Tensilica cores, eight megabytes of memory SRAM type, one gigabyte of memory type and LPDDR3 65 million. Logical switches. All this fits in a BGA package measuring 12 x 12 mm. This facilitates DSP processing data from various sensors and accelerates the recognition of user gestures, feeding information to the CPU in the "as prepared". Specialized processor to accelerate processing of data up to 200 times as compared with a pure software solution. It consumes less than 10 watts, and a serial interface supports PCI Express. Recall that the developers are able to get Microsoft HoloLens device in exchange for $ 3,000. Related Products :
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