The technological process for the production of semiconductors have ceased to be exclusive. For example, three of the leading companies - Intel, Samsung and TSMC - approached the production of chips with the norms of 10 nm. Experts also are aware that the old linear reduction in the production scale itself has become obsolete. Nevertheless, the infamous Moore's Law, as a manifestation of the inexorable development of technological production of chips, promises to continue its development, although this development will be largely virtual.
On Monday, the Japanese city of Toyama Annual Conference kicks off IEEE Asian Solid-State Circuits Conference. One of the key presentations at the event will be dedicated to the development of semiconductors projected for the next 30 years, to be made by the executive director of the Taiwan Semiconductor Industry Association Association, Liu Nicky (Nicky Lu). According to the speaker, the semiconductor industry with the transition to vertical (FinFET) transistors included in the conditional stage of Silicon 2.0, and will continue to evolve in the process of Silicon 3.0, 4.0 and so on. At Silicon 3.0 chips will be multi-layered, similar to the current production of 3D NAND and Phase Silicon 4.0 will match the multi-chip package chips in one case with vertical through-connections with a common substrate crystals on InFO type that already implements TSMC company .
At Silicon 4.0 is expected to transition to the process with linear rate of 1 nm. This, as well as an integrated approach to the compaction of chips (FinFET, multilayer structures, InFO-packaging, hybrid combination of logic and auxiliary chips) will lead to the fact that the stagnation in the industry for the production of semiconductors, explosive growth will change. So, if today the market of chips is reduced and is approximately $ 400 billion per year, Silicon 4.0 concept will chip market overcome an annual turnover of $ 1 trillion. In general, everything will be fine. Related Products :
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