According to source, Intel will combine on a common substrate four-core Kaby Lake crystals, produced in 14-nm technology, and some graphics solutions AMD - perhaps even supporting memory such as HBM2. The communication between the computational cores and the graphics subsystem will be done via the PCI Express x8 interface.
So far, only two models of the Kaby Lake-G family are planned to be released, and both will have a BGA (58.5 x 31 mm) design, which means mounting the processor directly to the motherboard. These processors should be used in gaming laptops of reduced thickness. Kaby Lake-G models will have four computational cores, and will differ in the value of TDP. Most likely, they will have different frequency characteristics. Related Products :
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