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Recently, GLOBALFOUNDRIES company representatives , speak about their plans. In this case (Doug grose) described about its plans with respect to the development of Dresden fab 1, in which entered Fab 36 (Module 1) and Fab 38 (Module 2).
In the next two years, the production volume of these factories will be increased to 50 000 silicic plates per month. Approximately, half of this quantity will be processed on the technology silicon on insulator (SOI), that allow to create central processors. Second-half will be processed on the bulk- technology, which allow to create microcircuits with monolithic base layer. This labor division will allow GLOBALFOUNDRIES to begin the production of 32 nm chips already to the end of 2009.
Fab 2 in the state New York, USA, will start to function in 2012, being occupied with the release of 32 nm and 22 nm chips. Now GLOBALFOUNDRIES develops the technology of immersion lithograph second generation, which allow to release 22 nm chips. In the opinion of GLOBALFOUNDRIES, the lithograph with the use of ultra hard ultraviolet (EUV), on which individual producers lay large hopes, will be inculcated later.
GLOBALFOUNDRIES is assembled to maintain relations with the centers of scientific developments, located in Germany: The center of nano-technologies and Fraunhofer institute in Berlin. The first center is located in the technological park, which belongs to qimonda company . GLOBALFOUNDRIES Company does not intend to depart from the joint enterprise AMTC . This enterprise was founded BY AMD, Toppan and Qimonda.
GLOBALFOUNDRIES does not desire to follow the example of TSMC, and to propose to its clients service on the development of chips. Related Products :
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