For a while back appeared the information, according to which Intel examines the possibility of introducing the module HSDPA (High speed downlink packet access) from nokia production in its new mobile platform santa rosa, whose debut is assigned the for the second quarter of present year.
According to new data from intel : According to the results from analysis we decided to not include module HSDPA in our mobile platform. we will continue to investigate the possibility of integration for the support of 3G networks in our mobile platforms.
Thus, in Santa rosa producer will be limited to the installation of adapter wireless network next-Gen Wireless- N (code name kedron), which supports the rough version of specification IEEE 802.11n. Notebook producers as Acer, ASUS, Gateway and Toshiba already began the deliveries of mobile PC with the built-in adapter kedron.