Heat pipes are more likely to appear in smartphones

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POSTER: computer news   ||   HEAT PIPES ARE MORE LIKELY TO APPEAR IN SMARTPHONES	DATE:2013-06-18
For a long time, mobile device worked without any special cooling systems.  But in today's devices are used very powerful processors that produce a large amount of thermal energy.  This in turn leads to strong heating of the body in certain areas, which may cause discomfort to the user with a low sensitivity threshold. NEC company came to solving the problem creatively by placing inside the smartphone heat pipe , which distributes heat evenly and prevents local overheating of the body.   NEC will follow the example of the world's leading manufacturers of smartphones Apple, Samsung and HTC.  And the first products of these manufacturers may appear as early as the end of this year. NEC smartphone , has a heat pipe with a diameter of 0.6 millimeters.  At present, the release of these heat pipes are engaged Furukawa, Chaun-Choung Technology, Auras and TaiSol Electronics, but so far due to the high production costs,  the company is actively working to improve the processes. Related Products :

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