The use of heat pipes to cool the smartphone components is not a news , NEC company already launched in the local market smartphone equipped with a heat pipe with a diameter of 0.6 mm. For mass distribution of heat pipes in the latest smartphone manufacturers would like to reduce their diameter to 0.4-0.5 mm.
Only in the next quarter, the market may be new smartphones models that use heat pipes. The heat pipes are capable of 13 times faster to remove heat, but at a comparable cost, they have a lower level of yield copies, and it is a problem for manufacturers. Related Products :
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