The thinner lithography process technology becomes, the more difficult its development - it concerns technical constraints and financial burden. For this reason, the timing of 10-nm technology development is now preferred, with varying degrees of confidence to speak only the leading manufacturers of semiconductors, GlobalFoundries in this sense, is tied to the process in the face of donor Samsung and IBM, as the company is does not make official statements, but unofficial sources we already know that by the middle of next year, the 10-nm Intel processors might not appear. At the very least, the lack of 10-nm processors Cannon Lake on the market in 2016 will have to compensate 14-nm processors Kaby Lake .
In the industry event in the beginning of last month TSMC company announced the release of an early prototype 10-nm products includes modules with four core ARM Cortex-A57. Of course, this still does not mean that some of the customers certainly TSMC will manufacture processors with the architecture Cortex-A57 for 10-nm technology, the prototype only used for debugging technologies and production processes.
TSMC expects that before the end of the year to begin pilot production of 10-nm real products, and mass production will be deployed as early as 2016-2017. The company combines the 10-nm process technology with so-called FinFET-structures. Earlier this year, TSMC has already demonstrated a silicon wafer with a 10 nm memory cells SRAM. Rival Samsung also expects to begin serial production of 10-nm products in 2016. Most likely, the first commodity products using 10-nm technology will be obtained in 2017. Related Products :
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