Another project scalping devices for Kaby Lake is available for download

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POSTER: computer news   ||   ANOTHER PROJECT SCALPING DEVICES FOR KABY LAKE IS AVAILABLE FOR DOWNLOAD	DATE:2017-01-31
The spread of three-dimensional printing devices and related services allowing enthusiasts to share three-dimensional digital models of various devices and components.  Overclockers took advantage of this technological progress, to start production of devices for the removal of the covers with Intel processors.  This procedure is necessary when there is an irresistible desire to replace the stock thermal interface in the processor cover.  Modern Intel processors have a fairly thin textolite substrate, which does not allow to remove the cover securely.  It is for this reason are spreading Special tools to facilitate the process of "scalping". Another project means for removing the cover from the processor and Intel Skylake Kaby Lake appeared on the pages of YouImagine where enthusiasts of three-dimensional printing share their experience.  The author of this model recognizes that a device designed according to available data on the size Kaby Lake processors, and practice performance of their offspring have not yet checked. It is also recommended to use a substrate of an elastic material to protect the processor from damage.  The device assembly with a processor inside, you must install and start the yews in closer sponge to cover the processor shifted and separated from the crystal.  Naturally, for processors with solder under the cap, this method is not suitable. Related Products :

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