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On the past week IBM company and its partners announced the development of 28- nm technological process, which will be used for economical integrated microcircuits for portable electronics.
However, here Intel company does not plan to master the 28 nanometers for the preparation of new generations processors ., After the beginning the release of 32- nm product, the development of 22- nm technical process is registered as its basic purpose. Specifically, this technology will be used for preparing ivy bridge, Haswell and Larrabee processors. Intel is indicated the 2011 year as the release date of such a solution .
It is worthwhile to note that the passage to a thinner technical process will introduce a reduction in the sizes of integrated microcircuits. This is especially important soon when the market will be full with central processors with the integrated graphic core. According to preliminary information, the core area due to this upgrade is substantially increased. An increase in the quantity of component elements invariably leads to an increase in the number of inefficient blocks, but a smaller quantity of manufactured microcircuits, obtained from one plate, reduces the total release volumes (with an equal quantity of utilized silicic plates).
Passage on 22- nm technical process solves this problem, and also many others: it reduces the required power, allow to increase the performance of integrated microcircuits . Related Products :
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