An increase in the silicic plate diameter is one of the ways for reduction in the prime cost of micros-chip production - the sum of expenditures in this case is transferred for a larger quantity of chips. Now most productions use silicic plates with 300 mm diameter, whereas about the passage periods on 450 mm plate analysts do not have any opinion. The rates of migration to the larger plates depend on economic situation, since for the modernization of equipment and technological processors enormous sums are required.
As reports associate, globalfoundries company issues a call to semiconductor microcircuit producers to pay greater attention to the optimization of technical process, which uses present 300 mm plate. It is possible to squeeze out additional reserves, and passage on 450 mm plate under the current economic conditions do not make sense.
The consortium, in which enter Intel, Samsung and TSMC, plans to begin experimental production with the use of 450 mm silicic plates in 2012. Some producers, in this case will never use plates with this standard size, since they are expensive. Related Products :
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