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We continue our report about IDF Spring 2007 with data about architecture and characteristics of Intel future processors Intel. For example, it was explained that TDP level in mobile dual cores processors generation penryn can grow from 29 to 35 W.
It was also noted in IDF, that the planed for release in 2010 generation 32 nm processors gesher was renamed in Sandy bridge. Let us recall that Sandy bridge will bring architectural improvements, but not a simple update of technical process with insignificant core modernization as in the case from Nehalem to Westmere.
Associates gave their forecasts about the processor cores area and the quantity of transistors in Intel future processors .
- Kentsfield (65 nm, 4 cores, two crystals, 286 sq. mm, 582 mln. transistors) - > Yorkfield (45 nm, 4 cores, two crystals, 214 sq. mm, 820 mln. transistors);
- Merom 4M (65 nm, 2 cores, 143 sq. mm, 291 mln. transistors) - > Penryn 6M (45 nm, 2 cores, 107 sq. mm, 410 mln. transistors);
- Merom 2M (65 nm, 2 cores, 113 sq. mm, 167 mln. transistors) - > Penryn 3M (45 nm, 2 cores, 81 sq. mm);
- Merom- L (65 nm, 1 core, 80 sq. mm, ~100 of mln. of transistors) - > Penryn- L (45 nm, 1 core, ~60 sq. mm).
According to our associates, single core processors Conroe- L and Penryn- L have the reduced relative to the nearest dual cores relatives area core. So this assert that processors Conroe- L will use different stepping from Allendale and Conroe .
As far as processors generation nehalem are concerned, associates give only the quantity of transistors in dual core version - 570 mln. pieces. On Westmere and Sandy bridge there are no data , but the core areas are approximately indicated by the arrangement of corresponding processors along the vertical scale:
- Nehalem (45 nm, 2 cores) - > 140-145 sq. mm;
- Westmere (32 nm) - > 103-105 sq. mm;
- Sandy bridge (32 nm) - > 163-165 sq. mm.
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