TSMC talk about the future and the present of the lithographic industry

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POSTER: computer news   ||   TSMC TALK ABOUT THE FUTURE AND THE PRESENT OF THE LITHOGRAPHIC INDUSTRY	DATE:2013-04-14
To stay on the position of the first-largest contract chipmaker amid intensified competition from Samsung and Globalfoundries, TSMC company has to speed up the process of development and implementation of new technologies.  According to Morris Chang, head of the Taiwanese company, to the end of 2013 TSMC plans to test its product range with the topological rules of 16 nm. Mr Chan said that Moore's Law, which governs the development of the semiconductor industry, will operate another 7-8 years.  During this period, the opportunity to develop technologies with a rate of 10 or even 7 nm.  Thus, since the end of 2015, the contractor expects to go to the deep ultraviolet photolithography (EUV) with a rate of 10 nm.  In this case, TSMC does not put all eggs in one basket: research is underway in the area of electron-beam lithography, to be considered as a possible alternative to EUV.  Just this year, small caps cost TSMC will exceed $ 9 billion, while in 2009 for similar needs have been spent only $ 2 billion. About a year ago, TSMC could not cope with the orders for the products with the provisions of 28 nm, and even the company's customers were looking for a new alternative.  But the contractor is actively working to expand the corresponding production in April  last year, half the design capacity   has earned Gigafab 15, the foundation of which was laid in June 2010.  For 8 months from the start of factory ramp up a monthly plates up to 50 thousand units.  Next month Gigafab 15 is fully operational, so after five months, the production volume will increase by 50,000 wafers per month. If before TSMC will run one production line in a year, now the Taiwanese plan to increase that number to three.  TSMC will increase its total capacity from the current 1.3 million wafers per month to 13.5 million.  Samsung, which dreams of victory over Taiwan's electronics industry, today, can produce about 900,000 wafers per month. TSMC expects that this year's production of 20 nm will be given to about 20 decisions.  However, their mass production will begin only in 2014.  And in 2017 the number of 20-nm products will be comparable to the volume of 28-nm today. As already mentioned, by the middle of 2015 TSMC expects to begin shipping its first product with a rate of 10 nm, produced by EUV technologies.  According to Mr. Sun, lithographic machine must handle more than 100 plates per hour, otherwise the production will not be cost-effective.  Now experts are working with TSMC facilities ASML NXE: 3100 for the creation of product samples using transistors FinFET, but in the future, the company will move to the machine model NXE: 3300. TSMC is working on real three-dimensional chips with through connections (Through-silicon via, TSV).  TSV thickness will be reduced from six to two microns, and in May, the 28-nm production will be transferred to the three-dimensional memory chip. But the use of wafer size 450 mm TSMC will not be before 2016.  Currently, the Taiwanese company is testing prototypes of equipment for processing 450-mm wafers, its mass production will begin in late 2015.  However, immersion lithography systems for 450-mm wafers will not be ready until the end of 2017, corresponding to EUV-machine will be only at the beginning of 2018. Note the difference in size between the 300-mm and 450-mm plates.  Area last approximately 2.25 times more Related Products :

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