The first products with PCI express 3.0 support will appear not earlier than 2010. This interface will increase the capacity to 8 GB/s, witch has higher capacity than the planed for release PCI express 2.0 ( 5 GB/s ). developers promise, that the real transmission speed in PCI express 3.0 will be twice higher than in PCI express 2.0.
At the autumnal session IDF fall 2007, intel company is assembled to speak not only about the interface USB 3.0. As reported associate with reference to PCI-SIG representatives , on this measure will be told new details about the interface PCI express 3.0. In particular, its form factors and some electrical interface characteristics .
It is assumed that motherboard with PCI express 3.0 support can work with video cards, that consume up to 300 W. Let us note that this possibility will be introduced within the present PCI express 1.x. The slot PCI express 2.0 already raised the supplied power from 75 to 150 W; however, hardly PCI express 3.0 will follow its example. Most likely, additional power will be consumed through the additional power connector , connected to the video card.
According to PCI-SIG forecasts , to the end of 2008 the interface PCI express 2.0 will start to reach the market. Up to this critical moment will appear many motherboard, whose PCI express x16 slots will correspond to the specifications PCI express 2.0. In the present year this attribute will be available mainly in motherboard on base of expensive chipsets (X38 RD790), and only in the fourth quarter the popularization of PCI express 2.0 will be expanded by NVIDIA after the announcement of more accessible chipsets with support of this interface.