Contractual services supported by leading developers of Intel package for designing chips
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POSTER: computer news || CONTRACTUAL SERVICES SUPPORTED BY LEADING DEVELOPERS OF INTEL PACKAGE FOR DESIGNING CHIPS |
DATE:2014-06-04 |
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From 2 to 6 June in the United States will host the annual conference of Design Automation Conference (DAC), devoted to the design of semiconductor circuits. For some time, Intel is involved in this event, not as a client but as a service provider. Perhaps by coincidence, Intel company began to release contract semiconductors. Further develop this direction the company intends only true way - giving potential customers the best possible tools for chip design. Yesterday Intel published a series of press releases, which reported on cooperation with all the leading developers of software packages for automated design of electronic circuits. All packages are optimized for creating solutions with a 14-nm process technology and using the vertical transistors (Tri-Gate). Packages of ANSYS will allow Intel customers to estimate the costs of electromigration and assist in product verification. Packages of Mentor Graphics also involved in the processes of checking circuits and the simulation of future products. Synopsys company will access to create a DDR3 memory controller and will help to optimize SoC in terms of consumption and performance. DDR4 controller will help develop the company Cadence Design Systems, as well as provide the tools to work with other chains. All these tools are available immediately. Unlike Samsung company , which yesterday made a similar announcement in relation to the 14-nm process, Intel has already have extensive practical material for semiconductors assessment issued with the application of these rules. Therefore, in terms of implementation of 14-nm process technology, Intel is ahead of Samsung. Another thing that the South Korean manufacturer is much greater experience in providing contract manufacturing of semiconductors. | ||
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CONTRACTUAL SERVICES SUPPORTED BY LEADING DEVELOPERS OF INTEL PACKAGE FOR DESIGNING CHIPS |
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