Intel expands the range of services for semiconductors contract registration

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POSTER: computer news   ||   INTEL EXPANDS THE RANGE OF SERVICES FOR SEMICONDUCTORS CONTRACT REGISTRATION	DATE:2014-08-30
Intel has continued to systematically solve problems with the organization of their factories contract manufacturing.  For her, it is an extremely important issue.  This year, for example, to produce their own solution using 14-nm process,  decided the Japanese company Panasonic.   Fresh press release, Intel announces the completion of the list of services Custom Foundry division two innovations.  As you may know, it is now fashionable to talk about the issue 2.5D--and 3D-chip layouts using sufficiently thin metallic compounds through TSVs.  The other day, for example, Samsung has reported the launch of 4-Gbit chips DDR4, taken with TSVs-compounds.  Contrary to this progressive trend of Intel company , interestingly, categorically rejects the use of TSVs.  The company has said it in March , when introduced to customers on a contract packaging type SiP, and talking about it now.  According to the manufacturer, the outer wire harness crystals themselves do not become obsolete, and makes it possible to save on production. New service Intel Custom Foundry - an opportunity to pack a few inexpensive heterogeneous crystals in one package with an inexpensive bridge as a substrate.  The crystals thus be linked to the bridge with the help of wires.  The service is called Embedded Multi-die Interconnect Bridge (EMIB) and is an alternative to TSVs-generation compounds 2.5D.    It will happen just because the external wire harness lengthen the signal path and cause losses in the conductors.  But cheaper, because they do not need to change equipment.  Obviously, the company hopes to make up for deficiencies EMIB more advanced 14-nm process technology. The second service is a fresh Intel's customers for contract semiconductors - is to provide customers with proprietary hardware and software platform High Density Modular Test (HDMT) for verification descended from the conveyor crystals. This is a personal Intel tool  , which it used for its own needs, but from now on, this tool will be available to all customers.  With regard to technology EMIB, then the first delivery assemblies experienced company will begin to ship to customers in 2015. Related Products :

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