According to the expert in the photomask - Franklin Kalk , the chief technologist of the company Toppan Photomasks - lithographic projection using the hard ultraviolet radiation requires significant improvements, has not yet begun to be use in the production properly. Meanwhile, the technology was proposed in 1985 - 31 year ago. Then the projection with a wavelength of 13.5 nm, called the Soft X-Ray, and only in 1993 was called EUV (Extreme Ultraviolet). As Franklin jokes, EUV-lithography, he started to study at the Institute and now in his old age is ready for meeting.
The first pilot production using EUV-scanners revealed a number of equipment and technologies shortcomings. Beach modern 193-nm lithography production - alternate use of multiple photomasks for projection on each layer (up to four templates) - largely manifest in the case of EUV-lithography. Commercial introduction of EUV is expected with the launch of 5-nm chips, and already for this technical process may require more than one photomask for each layer. In the case EUV-lithography problems such as an increase in the number of defects and increased clogging of the optical system and mask. It is believed that the defects on the photomask 20 - is close to the ideal.
To improve the resolution of optical scanners EUV-systems (for reducing the number of photomasks by the projection 5 nm and less technological standards) numerical aperture optics must be greater than 0,5 NA and likely anamorphic. This means that the image horizontally and vertically will have a different scale - x4 and x8 one plane to another. Such an optical system is developing ASML company , but when it will be implemented in practice, is unknown.
At the same time industry Franklin is sure that this will be the last projection EUV lithography technology for the production of semiconductors. The most promising technology, according to experts, will be the technology of self-assembled molecular structures, for example, on the basis of DNA. After assembly, such structures may be used as a template for printing chips. This technology is actively being developed by Tokyo Electron and Applied Materials. Progress in development is possible in 5-10 years.