TSMC Company is the partner of AMD and NVIDIA in video chip and chipset production ; therefore the rates of its technological rearmament depends on customers need. It is known that in the following half-year TSMC can master the release of 40 nm products.
Associate reports that TSMC will master the production of 32 nm semiconductor products at the end of 2009, but it will forego the introduction of materials with high value dielectric constant (high- k) and transistors with metallic lock in this stage. In first 2010 half , the release of 28 nm products will be fixed, which will use the technologies indicated. Both technical processes will rest on the lithograph immersion with the wavelength 193 nm. Within the 28 nm technical process will be used one new material - oxynitride silicon (SiON).
TSMC will propose 32 nm technical process as the more economical alternative for 40 nm technology, and will inject the advanced materials within the 28 nm technical process.
TSMC Clients can obtain 32 nm production only in the productive version, since the technical process version for devices with low energy consumption level in this stage will not be developed. The 28 nm technical process will be proposed in two energy classes. The first 28 nm prototypes will be obtained BY TSMC at the end of present year.