ASML is confident in the superiority of EUV-lithography, but fears for the fate of the 450-mm production

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POSTER: computer news   ||   ASML IS CONFIDENT IN THE SUPERIORITY OF EUV-LITHOGRAPHY, BUT FEARS FOR THE FATE OF THE 450-MM PRODUCTION	DATE:2013-02-20
Yesterday began the Annual Conference of International Solid-State Circuits Conference (ISSCC 2013). In their experiments, ASML failed to prove in practice that the radiation in the ultraviolet range of ultra-rigid to control and further optimization.  Emulation of a continuous cycle with 40-watt light source allowed to enter the theoretical performance figures of 165 wafers per hour with a level of 0.01% .  The company also conducted an experiment which could control 60-watt light source for 40 hours, and it gave a stable result. Today, the theoretical limit of performance for the production of wafers up to 250 plates per hour.  Transition to EUV-projection, so will be accompanied by a decrease in production and an increase in production costs.  Since the beginning of  EUV-production in 2014, promises to achieve the performance of scanners 70 plates per hour.  Radiation power at the same is unlikely to exceed 60 watts.  Ideally, the developer should bring output power up to 250 W, but even with such power the working performance of EUV-scanners will remain at a level of 100 wafers per hour. According to ASML, the most appropriate to deploy EUV-scanner will move to 10-nm process.  Such production would require only one photomask for projection. Intel company , for example, believe that the 10-nm semiconductor can produce with the old equipment and four-five photomasks.  However, Intel has invested enormous resources in developing EUV-equipment and bought a stake in ASM.  As calculated ASML, even triple projection ceases to be profitable and easy to use. To further reduce the scale of production methods, however, in considering options for ASML double and triple exposure for 7-nm level and 3 nm.  In addition, the variants on the serial reduction wavelength optics and improve the transition to self-organizing structures. It is assumed that the first 450-mm equipment will work in 2018 on the second generation EUV-scanners.   In the calculations presented by the relative price of a square meter on 450-mm wafers can be 22% higher than in the case of 300-mm wafers.  Situation promises equalized with the transition to a brand new 450-mm equipment that will be installed on new production, originally targeted for processing 450-mm wafers.  In other words, the greatest effect will be on those factories to be built from scratch and without the use of, let's say, a 300-mm infrastructure.  This is not just lithography equipment, but also the entire organization of production, from bringing up, storage and supply of plates and finishing systems and other water treatment .   Related Products :

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Xtreview Support N-Post:xxxx Xtreview Support	ASML IS CONFIDENT IN THE SUPERIORITY OF EUV-LITHOGRAPHY, BUT FEARS FOR THE FATE OF THE 450-MM PRODUCTION
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