The development of efficient cooling systems for CPUs with 3D design

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POSTER: computer news   ||   THE DEVELOPMENT OF EFFICIENT COOLING SYSTEMS FOR CPUS WITH 3D DESIGN	DATE:2013-04-12
Georgia Institute of Technology has signed a three-year contract to develop a liquid cooling system for CPUs with three-dimensional design.  Its partner was Rockwell Collins company - the leading U.S. manufacturer of programmable logic controllers and electrical equipment supplier to the aviation industry and government agencies of the United States.  The contract worth $ 2.9 million.   The purpose of this is to raise the efficiency of businesses currently existing cooling systems for this type of processor is at least 10 times.  This is planned to be achieved through the use of so-called non-uniform cooling when the hottest areas receiving increased attention.  Thus, with a total heat sink the system is equal to 1 kilowatt per square centimeter, millimeter, you can specify several areas where it will be up to five times.  In addition to developing the engineering design of the cooling system, the researchers from Georgia will in parallel study the properties of various fluids. Related Products :

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